Power Semiconductors Discretes and Stacks 2019 CATALOGUE
●Mounting Procedures for Stud Screw Fit Devices
▲Stud devices have various advantages in use when compared to other case types; they are hermetically sealed, versatile and robust. However, some guidelines must be followed in order to not damage them during assembling nor reduce their lifetime.
▲Terminal soldering guidelines for stud devices without stranded wire rope
■The component must be preferably mounted into the heatsink first, which will avoid internal overheat of the device. If a heatsink is not used the soldering time must be reduced to the minimum necessary;
■An thermostatically-controlled soldering iron must be used and its temperature must be between 250°C and 350°C in order to avoid both cold solder joint or damage to the isolation of the wire to be soldered;
■Pre-heat the eyelet using the soldering iron during 3-10 s, depending on device’s size and iron temperature;
■Contact time between soldering iron and device eyelet must be limited to approx. 10-30 s during soldering, depending on iron temperature and component’s size;
■Clean the eyelet after the soldering process with a brush soaked with Isopropyl Alcohol (wait until the component cool down);
■Forces applied to the eyelet may damage the semiconductor chip inside the component. The cable to be soldered cannot apply significant forces on the device’s upper contact;
■The final solder must be homogeneous, with good wetting and forming a meniscus with concave surface
▲Guidelines for cable connection by screw and nut
■Attach the cable to the component before mounting it in the heatsink - this will avoid damaging the device during mounting;
■The cable’s eyelet must be compatible with the device’s eyelet to assure good electrical connection;
■Nut and screw with dimensions compatible to the eyelet must be used together with adequate flat and lock washers;
■Use preferably one box-ended wrench and a torque wrench to apply torque to the screw;
■The applied torque to the screw must be within the permitted range, with the device free suspended during the operation to avoid forces over the isolation glass
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