THERMFLOW® T777 Low Thermal Resistance THERMFLOW® Phase Change Pad Polymer Solder Hybrid (PSH) Thermal Interface Material
performance devices requiring minimum thermal resistance for maximum thermal performance and component reliability. T777 provides the superior long term reliability performance of phase
change materials with the added benefit of enhanced thermal stability over conventional phase change pads. T777 is a 0.0045 inch (0.115mm) thick, inherently adhesive film that softens at
device operating temperatures resulting in “grease-like” performance. Unlike traditional phase change materials, PSH materials incorporate low-melt metallic fillers as well as polymer systems to
maximize both thermal conductivity and thermo-oxidative stability.
T777 has demonstrated reliable thermal performance during thermal cycling, humidity, and long term accelerated aging tests
(equivalent operating condition of 5 years at 70°C). It was developed for next generation Intel microprocessors.
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T777 、 WW-XX-YYYY-ZZZZ 、 T710 、 T725 、 T766 、 T557 、 T558 、 THERMFLOW® T777 |
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[ Microprocessors ][ Graphics Processors ][ Chipsets ][ Memory Modules ][ Power Modules ][ Power Semiconductors ] |
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Datasheet |
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RoHS 、 UL 94V-0 |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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08/07 |
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Rev A |
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TB 1027 EN |
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283 KB |
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