TR 1018 EN T777 Reliability Test Report
T777 is a high performance Polymer Solder Hybrid (PSH) material and is the latest addition to Chomerics’ THERMFLOW® family of Phase Change Materials (PCM). T777 has very low thermal impedance, enhanced thermal stability, and excellent long-term reliability demonstrated by End-Of-Life performance through 5 years at 70°C. T777 was developed for next generation Intel microprocessors for mobile applications. It was optimized for Intel Santa Rosa platform, Intel CPU chips and verified with Intel Yonah test vehicle.
|
|
|
|
Test Report |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
July 2007 |
|
|
|
|
|
TR 1018 EN |
|
|
425 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
