THERMFLOW® T777 Application Guide
●THERMFLOW T777 material is a new addition to Chomerics’ THERMFLOW family of phase change materials. This polymer solder hybrid material can be used wherever high heat transfer and low thermal impedance are required. Typical applications are thermal interface pads for microprocessors, graphics processors, ASICs, DSPs, power modules and anywhere else thermal grease or metallic solder is used. Unlike thermal grease, T777 is solid at room temperature and is easy to handle during manufacturing. However, at typical application operating temperatures, T777 softens and flows to produce high thermal performance by achieving minimum bond-line and maximum surface wetting. Also, unlike metallic solder, T777 does not require backside metallization on the die for soldering. Upon end-user application, T777 is re-workable and does not have a joint stress associated with metallic solder.
●This Application Note contains recommendations on how to specify, handle and install T777 thermal interface pads.
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thermal interface pads 、 pads 、 polymer solder hybrid material |
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Solutions |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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January 2023 |
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CHOAG1008 |
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278 KB |
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