THERMFLOW® T777 Low Thermal Resistance THERMFLOW® Phase Change Pad Polymer Solder Hybrid (PSH) Thermal Interface Material

2019-07-11

Parker Chomerics

T777WW-XX-YYYY-ZZZZT710T725T766T557T558

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Datasheet

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Please see the document for details

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English Chinese Chinese and English Japanese

08/07

Rev A

TB 1027 EN

283 KB

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