THERMFLOW® T777
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Low Thermal Resistance THERMFLOW® Phase Change Pad
Polymer Solder Hybrid (PSH) Thermal Interface Material
Phase-Change
DESCRIPTION
Polymer Solder Hybrid T777 Thermal Interface Material is specially formulated for use in high
performance devices requiring minimum thermal resistance for maximum thermal performance
and component reliability. T777 provides the superior long term reliability performance of phase
change materials with the added benet of enhanced thermal stability over conventional phase
change pads. T777 is a 0.0045 inch (0.115mm) thick, inherently adhesive lm that softens at
device operating temperatures resulting in “grease-like” performance. Unlike traditional phase
change materials, PSH materials incorporate low-melt metallic llers as well as polymer systems to
maximize both thermal conductivity and thermo-oxidative stability.
FEATURES/BENEFITS
Low thermal impedance
Excellent long term EOLife (End of Life) performance
Proven high temperature reliability
Easy to handle and apply, peel-and-stick
Available in free lm with release liners for ease of use
Can be die-cut and tabbed for ease of installation
Inherently tacky - no adhesive required
No pump-out associated with thermal grease
Lower joint stress compared to metallic solder
Reworkable
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TYPICAL APPLICATIONS
Microprocessors
Graphics Processors
Chipsets
Memory Modules
Power Modules
Power Semiconductors
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T777 has demonstrated reliable thermal performance during thermal cycling, humidity, and long term accelerated aging tests
(equivalent operating condition of 5 years at 70°C). It was developed for next generation Intel microprocessors.
THERMFLOW™ T777 Phase-Change Material
Physical
Typical Properties T777 Test Method
Color Gray Visual
Carrier None - Free lm --
Standard Thicknesses, mm (in) 0.115 (0.0045) ASTM D374
Specic Gravity 1.95 ASTM D792
Phase Transition
Temperature, °C
45 / 64 ASTM D3418
Weight Loss, 125°C for 48 Hours <0.5% --
Thermal
Thermal Impedance @ 70°C, °C-cm
2
/W (°C-in
2
/W)
@ 10 psi 0.13 (0.02)
ASTM D5470 @ 20 psi 0.097 (0.015)
@ 50 psi 0.035 (0.0055)
Operating
Temperature Range, °C
-55 to 125 --
Electrical
Volume Resistivity, ohm-cm Nonconductive ASTM D257
Regulatory
Flammability Rating V-0 UL 94
RoHS Compliant Yes Chomerics Self Certication
Shelf Life, months from
date of shipment
12 Chomerics
THERMFLOW® T777
MATERIAL HANDLING
Commercial THERMFLOW® T777 pads are dened by Chomerics as “articles” according to the following generally recognized regulatory
denition for articles. An article is a manufactured item “formed to a specic shape or design during manufacturing,” which has “end use functions”
dependent upon its size and shape during end use and which has generally “no change of chemical composition during its end use. In addition,
there is no known or anticipated exposure to hazardous materials/substances during routine and anticipated use of the article.
These material is not deemed by Chomerics to require an MSDS. For further questions, please contact Chomerics at 781-939-4850.
Ordering Information
INSTALLATION GUIDELINES
After cutting the pad to the required size, remove the clear cover liner, and place the pad onto the integrated heat spreader, heat
pipe or heat sink, using the inherent tackiness of the phase change layer to hold the pad in place. If pads are kiss cut and tabbed
on a roll, gently peel back the edge of the pad from the clear carrier liner. Minor scratches will not affect pad performance. After
attaching the pad to the heat plate, remove the top protective liner just prior to mounting the heat spreader onto the microprocessor
device.
For optimum performance, T777 pads must be exposed to temperatures above 64ºC during operation or by a burn-in cycle. If the
operating temperature design is lower than 64°C, the material should be exposed to a one time burn-in cycle to achieve lowest
thermal impedance. On reaching the required burn-in temperature, the T777 pad will fully change phase and attain MBLT (mini-
mum bond-line thickness less than 0.001 inch or 0.0254mm) and maximum surface wetting. After this melt temperature is reached
initially, the electronic component can now run at the lower design temperatures with resultant superior thermal performance.
Part Number:
6
WW XX YYYY ZZZZ
64 = Roll stock
10 = 100 ft.
40 = 400 ft.
XX = Custom length
YYYY =Roll stock width:
Examples
1000 = 1”
0750 = 7.5”
2400 = 24”
ZZZZ = Material class
(T710, T725, T766, T557, T558, T777)
66 = Roll stock with PSA
YYYY = 0808 (8” X 8” Sheet / 20.3 cm X
20.3 cm). Custom YYYY sizes available.
ZZZZ = T710 only product available with
PSA. (no need for PSA)
All others are inherently tacky
68 = Roll stock
with PSA and release tabs
69 = Custom die-cut part
11 = without PSA
12 = with PSA one side
Custom Part Number.
Conatct Chomerics
ZZZZ = Material class
(T710, T725, T766, T557, T558, T777)
WARNING – USER RESPONSIBILITY
FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREIN OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE.
This document and other information from Parker-Hannin Corporation, its subsidiaries and authorized distributors provide product or system options for further investigation by users having technical expertise.
The user, through its own analysis and testing, is solely responsible for making the nal selection of the system and components and assuring that all performance, endurance, maintenance, safety and warning requirements of the application are met.
The user must analyze all aspects of the application, follow applicable industry standards, and follow the information concerning the product in the current product catalog and in any other materials provided from Parker or its subsidiaries or authorized distributors.
To the extent that Parker or its subsidiaries or authorized distributors provide component or system options based upon data or specications provided by the user, the user is responsible for determining that such data and specications are suitable and
sufcient for all applications and reasonably foreseeable uses of the components or systems.
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OFFER OF SALE
The items described in this document are hereby offered for sale by Parker-Hannin Corporation, its subsidiaries or its authorized distributors. This offer and its acceptance are governed by the
provisions stated in the detailed “Offer of Sale” elsewhere in this document or available at www.chomerics.com
CHOMERICS and THERMFLOW are registered trademarks of Parker Hannin Corporation. ®2007 All rights reserved.
TB 1027 EN 08/07 Rev A
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Aging Time (Hours)
Thermal Impedance (°C cm²/W)
Grease
T777
T777 exhibits a relatively small increase in thermal impedance with 120°C aging compared to a commonly used thermal grease.