PRELIMINARY APPLICATION SPECIFICATION FOR 75594-0000 HIGH SPEED EDGE CARD
SCOPE: This document is NOT intended to be the final process definition nor is it intended to constrain design. This document contains general guidelines. Settings will vary according to the actual process and equipment used. The document addresses the manufacturing techniques and end-usage considerations for Molex’s 75594-0000 High Speed Edge Card interconnect system. This system consists of 170 circuits on 0.75mm pitch. Various circuit sizes may be developed. Attachment to the Mother Board is (press-fit) compliant pin. No soldering is required.
EDGE CARD CONNECTOR 、 HIGH SPEED EDGE CARD 、 High Speed Edge Card interconnect system |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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12-Nov-2007 |
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REV.A |
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AS-75594-001 |
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848 KB |
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