TSE2004GB2B0NCG8 TSE2004GB2B0NCG8/B TSE2004GB2B0NCG8/M PRODUCT/PROCESS CHANGE NOTICE
● Product Affected:TSE2004GB2B0NCG8, TSE2004GB2B0NCG8/B,TSE2004GB2B0NCG8/M
● DESCRIPTION AND PURPOSE OF CHANGE:This notification is to advise our customer that IDT is transferring the wafer fab production currently manufactured in Global Foundry (GF) to Semiconductor Manufacturing International Corporation (SMIC).SMIC will closely match the GF process for the products transfer. There is no expected change to the data sheet, package or backend manufacturing process.There will be change in the top mark and ordering part number as shown in the below table. The current part will be discontinued as of the effective date of this PCN.
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TSE2004GB2C0NCG 、 TSE2004GB2B0NCG8 、 TSE2004GB2B0NCG8/B 、 TSE2004GB2B0NCG8/M 、 TSE2004GB2C0NCG8 、 TSE2004GB2C0NCG8/B 、 TSE2004GB2C0NCG8/M |
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PCN/EOL |
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Please see the document for details |
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VFQFP-N |
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English Chinese Chinese and English Japanese |
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June 15, 2018 |
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M1806-01 |
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600 KB |
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