RELIABILITY AND QUALIFICATION OF UMS PROCESSES
●Failure Mechanisms (2)
■intrinsic failure mechanisms:
▼transistor:
◆ohmic contact degradation
◆ surface effects
◆hydrogen poisoning
◆Non-pinch-off (NOPO)
◆hot electrons
▼metallisations:
◆purple plague
◆electromigration
▼dielectrics:
◆ESD
◆MIM short circuit
◆BCB delamination
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Test Report |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/08/29 |
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1.1 MB |
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