SPIE Photonics West 2022 to Include Kyocera’s Ceramic Package and Optical Component Solutions
KYOCERA, the world leader in Fine Ceramics, exhibited its latest optoelectronic products and technologies Jan. 25-27 at SPIE Photonics West 2022, Booth #4314, in San Francisco’s Moscone Center — showcasing components that enable new innovations in communication, sensing, 3D imaging, industry, medicine, and smart vehicles.
Photonics West, the world’s leading photonics technology event, gives a global audience access to major brands, startups, and the industry’s most influential leaders and advocates.
Kyocera’s cutting-edge ceramic package and optoelectronic lens solutions support the most demanding semiconductor and laser applications. Kyocera will exhibit a wide range of technologies, highlighting multiple ceramic package technical approaches for autonomous driving and LIDAR module applications. The company also showed its Semiconductor Microelectronics Assembly Service capabilities supporting various markets.
Ceramic Packages for LIDAR Applications
- Ceramic Packages for Integrated FMCW (Frequency-Modulated Continuous Wave) modules for Level 4 and 5 autonomous driving applications
- Ceramic Packages for OPA (Optical Phased Array) FMCW modules
- Ceramic Packages for discrete modules used in ToF (Time of Flight) and ADAS (Advanced Driver Assistance Systems) devices
- Open Tooled Package Tunable Lasers
- SOA (Semiconductor Optical Amplifier) Packages
- Ceramic Packages for Receivers and Detectors
- Ceramic Submounts for EEL (Edge Emitting Lasers)
- Ceramic Packages / Submounts for VCSELs (Vertical Cavity Surface Emitting Lasers)
- Ceramic Packages for MEMS Mirrors
Ceramic Packages / Substrates for Photonic Applications
- Ceramic Packages for Image Sensors (SPAD and CMOS)
- Large Size and Low CTE Ceramic Substrates for CT Scanners (Photo Diode Arrays)
- 3D Structural Ceramic Packages for Endoscopes
- High Thermal and High-Reliability Ceramic Substrates for LED and UV-LED Lamps
- Compact Ceramic Packages for MEMS Devices (Gas Sensors and Gyro Sensors)
- Ceramic Packages for 3D Sensors (IR LED) and High Flexural Strength Ceramic Substrates for 3D Sensor Devices
Semiconductor Microelectronics Assembly Service Capabilities
- Wirebond Assembly, Including Multichip Modules, MEMS, 2.5D and Hybrid Assembly
- Flip Chip Assembly, Including Various Thermal Interface Materials for Photonics ICs, Memory Devices and 2.5D Assembly
- Hermetic and Non-Hermetic Solutions
- High Reliability and Commercial Process Flows
- Highly Engineered Solutions
- Multi-level Component Sourcing Support
- Molded Aspherical Lenses
- Spherical Lenses
- Plastic Lenses
- Automotive Lenses
- Machine-Vision Lenses
- Scanner Lenses
- Line-Sensor Lenses
- F-Theta lenses
- UV, EUV and DUV Objectives
- Design of System Requirements
- Integration Analysis of Multiple Technology Platforms
- Laser, Illumination and Vision Systems
- Component Fabrication and Assembly
- MTF and WFE Performance Testing
- Performance Optimization
- Mass Production
Lasers
- Solid-State and Direct Diode Laser Products
- JUNO Series, Serving Biotech, Analytical, Medical and Measuring Field Applications
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