Alliance Memory Introduced High-Speed CMOS DDR SDRAMs With 256Mb, 512Mb, and 1Gb Densities in 60-Ball TFBGA and 66-Pin TSOP II Packages

2023-10-03 ALLIANCE News
High-Speed CMOS DDR SDRAMs,high-speed CMOS double data rate synchronous DRAMs,DDR SDRAMs,AS4C32M8D1

SAN CARLOS, Calif. — April 2, 2015 — Alliance Memory today introduced high-speed CMOS double data rate synchronous DRAMs (High-Speed CMOS DDR SDRAMs) with densities of 256Mb (AS4C32M8D1), 512Mb (AS4C64M8D1), and 1Gb (AS4C64M16D1) in the 60-ball 8-mm by 13-mm by 1.2mm TFBGA package and the 66-pin TSOP II package with a 0.65-mm pin pitch.


The devices released today provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, medical, communications, and telecom products requiring high memory bandwidth, and they are particularly well-suited to high performance in PC applications. The AS4C32M8D1, AS4C64M8D1, and AS4C64M16D1 are internally configured as four banks of 32M word x 8 bits, 64M word x 8 bits, and 64M word x 16 bits, respectively. The DDR SDRAMs offer a synchronous interface, operate from a single +2.5-V (± 0.2 V) power supply, and are lead (Pb)- and halogen-free.


The AS4C32M8D1, AS4C64M8D1, and AS4C64M16D1 feature fast clock rates of 200MHz and 166MHz and are offered in commercial (0℃ to +70℃) and industrial (-40℃ to +85℃) temperature ranges. The DDR SDRAMs provide programmable read or write burst lengths of 2, 4, or 8. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh, while a programmable mode register allows the system to choose the most suitable modes to maximize performance.


With the addition of the AS4C32M8D1, AS4C64M8D1, and AS4C64M16D1 to its portfolio, Alliance Memory now offers the most extensive lineup of DDR SDRAMs in the industry, featuring densities of 64Mb, 128Mb, 256Mb, 512Mb, and 1Gb. For Alliance Memory’s customers, the devices eliminate costly redesigns by providing long-term support for end-of-life (EOL) components. In addition, the company doesn’t perform die shrinks, which frees up engineering resources.

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