Smiths Interconnect enhances performance of its High-Density Signal PCB Connector HPH Series
Smiths Interconnect announced today the superior performance and suitability of the HPH Series connector family, as a result of rigorous testing at the Centre of Excellence laboratory in Kansas City, KS.
HPH Series
The HPH Series High-Density Signal PCB Connector has gained its reputation for reliability in harsh environments under various extreme environmental conditions, supporting high current ratings, low contact resistance, and minimal insertion and extraction forces while resisting high shock and vibration. Among the advantages offered by the HPH Series is exceptional resistance to fretting corrosion, maximizing data resolution, and the ability to operate under extreme temperatures (-55℃ to 125℃).
Now, it has been confirmed that the 0.6mm contacts are able to handle the far greater current without detrimental temperature rises (less than 30° rise). In fact, the HPH Series supports a current rating of up to 9 Amps per contact and has a contact resistance of 7mΩ max.
Here are some examples of the new current carrying capability tests:
• 8.5A at 30℃ rise, single contact
• 8A at 30℃ rise, 2 adjacent contacts
• 7A at 30℃ rise, 4 adjacent contact
Previously shock-tested to Military (MIL-DTL-55302) specifications, the HPH has now been further tested for shock and vibration to the very high standards of the European Space Agency (ESCC 3401).
The impressive power-to-size ratio and ruggedness are made possible by Smiths Interconnect's Hypertac® hyperboloid contact design: the three-dimensional symmetry of this configuration guarantees electrical continuity regardless of the demanding conditions. This design is also the one that contains the insertion/extraction force at an average of 1oz per contact in tests, increasing the mating cycle life of our connectors.
"The technological capabilities and flexibility of the HPH Series have long enabled it to provide a significant edge in military, aerospace, and commercial aviation applications," said Mark Kelleher, Vice President and General Manager of the Connector Business Unit at Smiths Interconnect. "Now, with the enhanced rating, we have demonstrated its suitability for use in the most demanding of environments where performance, safety, and reliability are essential."
- 【Datasheet】HPH Series
- 【Datasheet】HPH Series High Density Signal Connectors
- 【Datasheet】HPH Series High Density Signal Connectors
- 【Datasheet】HPH Series High Density Signal Connectors
- +1 Like
- Add to Favorites
Recommend
- Smiths Interconnect Acquires Reflex Photonics to Expand in High Speed Data Transmission Market
- How Smiths Interconnect Keeps The Medical World Connected
- Smiths Interconnect Expands into Burn-In Test Market with Acquisition of Plastronics
- Smiths Interconnect Expanded RF Filter Capability for European and Asian Markets
- Smiths Interconnect’s cPCI launched on NASA Mars Perseverance Rover – Interconnect Product of the Year
- Smiths Interconnect NXS Series, New Ultra-High Density, Space Qualified Interconnect
- Smiths Interconnect Deliver A New Highly Integrated Multi-channel Subsystem
- Smiths Interconnect Launches K-band Passive Components for Space Applications
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
