RF Chip Testing Socket Automatically Matched BGA Solder Balls, Ensuring High Reliability Performance
Flip over BGA sockets do not require installation tools or mounting holes on the target PCB board, maximizing space savings while reducing board costs; This product provides a compact surface mount testing solution using a small pitch micro BGA testing, debugging, and verification chipset; The compact device with surface mount design provides precision machined spring probes and automatically matched BGA solder balls, ensuring high reliability performance.
02 Product Features
● Flip type locking mechanism, convenient for quick placement and removal of chips;
● Base positioning, no need for chip fixing tools or installation hole positions;
● Compact structure, one-time clamping, complete all high-frequency and signal tests;
● Floating spring probe, automatically matched BGA solder balls;
● Ensure the reliability and consistency of indicators;
03 Develop input information
The BGA test base is a customized development device, and the following information is required to complete the customized development:
① BGA chip external dimensions and tolerances;
② BGA chip foot distribution, marking RF/low-frequency signal ports, port definition;
③ Low frequency port output J30 wiring requirements or according to our custom, current requirements;
④ RF port frequency range, standing wave, insertion loss, delay requirements, phase consistency, power requirements;
04 Performance Parameter
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