DL-RXC113L: High-performance FSK Wireless Receiving Module with TI-Chipcon CC113L Chip
DL-RXC113L was designed base on TI-Chipcon' S CC113L wireless transceiver chip. It is a compact, long-distance, high-performance wireless RF receiving module. The chip launched by TI-Chipcon is mainly set to 315MHz, 433MHz, 868MHz, 915MHz and other special frequency bands of the national networks. The sensitivity can reach -114dbm, the maximum transmission rate can reach 500Kbps.
There are 2 interface modes (SMD and DIP) been adopted, which can not only meet customers' SMT application, but also realize transverse and longitudinal welding through 2.0mm standard stitch arrangement. The small size of the module is convenient for portable products, and it can well meet the requirements of low-power system by combining with low-power MCU.
Basic information
Model:DL-RXC113L
Frequency:433M
Chip:CC113L
Power:-45~-35dBm
Voltage:1.8~3.6V
Sensitivity:-114dBm
Distance:500~600m
Size:19*17*2
Features
600m transmission distance (1200bps)
Working frequency: 433.92m (other frequencies need to be customized)
Operating voltage: 1.8V-3.6V
The most classical product in the SUB GHz RF modules
Support up to 255 independent channels, can achieve soft frequency hopping
Separate 64-byte RX FIFO and TX FIFO
Efficient SPI four-pins interface
Applications
Wireless sensor;
Home automation;
Automated data collection;
Industrial remote control, telemetry;
Data monitoring and transmission;
Home Appliance Control;
Security, alarm control;
Technical Parameter
DC characteristics
DC characteristics of the Module
RF characteristics (Unless otherwise stated, the temperature is 25 ℃, and VCC is 3.3V)
High frequency characteristic table of the module
Pins Definition
Pins Definition of DL-RTS4463PA Module
Size
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