DL-TXC1150: High-performance FSK Wireless Transmit Module with TI-Chipcon‘ S CC1150 Chip
DL-TXC1150 was designed base on TI-Chipcon' S CC1150 wireless transceiver chip. It is a compact, long-distance, high-performance wireless transmit module. The chip launched by TI-Chipcon is mainly set to 433MHz frequency band. The maximum transmission rate can reach 500Kbps, and the output power can range from -30dbm to + 10dbm through the register configuration.
This module integrates all RF-related functions. Users do not need to have a deep understanding of RF circuit design; they can use this module to easily develop wireless products with stable performance and high reliability, shortening the product development cycle.
There are 2 interface modes (SMD and DIP) been adopted, which can not only meet customers' SMT application, but also realize transverse and longitudinal welding through 2.0mm standard stitch arrangement. The small size of the module is convenient for portable products, and it can well meet the requirements of low-power system by combining with low-power MCU.
Features
● 200m transmission distance (1200bps)
● Working frequency: 433.92m (other frequencies need to be customized)
● Operating voltage: 1.8V-3.6V
● A classical product in the SUB 1GHz RF modules
● Support up to 255 independent channels, can achieve soft frequency hopping
● Separate 64-byte RX FIFO and TX FIFO
● Efficient SPI four-pins interface
Applications
● Wireless sensor;
● Home automation;
● Automated data collection;
● Industrial remote control, telemetry;
● Data monitoring and transmission;
● Home Appliance Control;
● Security, alarm control;
Technical Parameter
DC characteristics
DC characteristics of the Module
RF characteristics (Unless otherwise stated, the temperature is 25 ℃, and VCC is 3.3V)
High frequency characteristic table of the module
Pins Definition
Pins Definition of DL-TXC1150 Module
Size
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