TDK Starts Full-Scale Production of SmartSonic ICU-20201 Ultrasonic Time-of-Flight Sensor

PublishTime： 2023-09-06 Article Source：TDK InvenSense News

Key Points：

ICU-20201 is a high-performance ultrasonic ToF sensor, integrating PMUT (piezoelectric micromachined ultrasonic transducer) with an ultra-low power SoC (system on chip) in a miniature 3.5 x 3.5 mm² reflowable package
The MEMS sensors provide accurate range measurements at distances up to 5m over a wide and configurable Field-of-View (FoV) on any surface and under any lighting condition
Due to a powerful embedded processor and extended memory space, the sensors deliver high computational power allowing complete application algorithms directly on the chip
Provides sensing accuracy required in robotics, drones, smart homes/buildings, and mobile devices

TDK Corporation announces the start of full-scale production of its InvenSense SmartSonic™ ICU-20201 ultrasonic Time-of-Flight sensor. InvenSense’s SmartSonic™ family of ultrasonic Time-of-Flight (ToF) sensors integrate a MEMS PMUT (Piezoelectric Micromachined Ultrasonic Transducer) with an ultra-low power SoC (system on chip) in a miniature reflowable package. Based on ultrasonic pulse-echo measurements, the ToF sensor provides millimeter-accurate and robust range measurements to targets at distances up to 5m, in any lighting condition, including full sunlight, and independently of the target’s color and optical transparency.

This new sensor gives devices the sensitivity required for accurate obstacle avoidance or proximity/presence sensing, used frequently in robotics and drones, or mobile and computing devices for example. It is also highly relevant in settings that require shelf inventory monitoring or level sensing, such as in smart homes or smart buildings.

The ICU-20201 is the latest release in this sensor family that embeds a more powerful on-chip processor with higher computational power. The enhanced processing capabilities allow fitting and running a wide range of application algorithms on-chip, offloading the system MCU completely.

“Thanks to its enhanced capability, ICU-20201 allows the design of smarter and lower power solutions, making the final product greener, safer, and more aware of the surrounding environment,” said Massimo Mascotto, Director of Product Marketing, InvenSense, a TDK Group company. “Its increased computational capability enables smarter product design and an enhanced end-user experience for our customers and partners.”

The ICU-20201, with an ultra-compact package footprint of 3.5 x 3.5mm², is available.

Main applications

Presence detection and motion detection for smart door lock
Proximity/presence sensing for mobile and computing devices
Obstacle avoidance for robotics and drones

Main features and benefits

Second generation
Ultra-low power
Compact size; miniature ultrasonic sensor
Wide operating range from 20cm to 5m
Works in any lighting condition
Detects objects of any color and optical transparency
Customizable field of view (FoV) up to 180°
3.5 mm x 3.5 mm x 1.26 mm, 8-pin LGA package

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

New Products & Solutions

More>

This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.

Integrated Circuits