InvenSense® Ushers in the Era of Sensor System-On-Chip With the World’s First Integrated Motion Sensor and Multi-Core Processing
SAN JOSE, Calif.–(BUSINESS WIRE)–Jan. 6, 2015– InvenSense, the leading provider of intelligent sensor solutions, announced the world’s first Sensor System on Chip (SoC) integrating a 6-axis MEMS sensor, tri-core sensor hub, embedded Flash and SRAM, and software framework. The ICM-30630 disrupts the traditional discrete sensor subsystem in many applications by providing a true turn-key and open solution in the same footprint as a competitive sensor-only device (3mm x3mm x1mm LGA package).
The ICM-30630 consists of three distinct processors; an ARM Cortex-M0 microcontroller and InvenSense’s next-generation Digital Motion Processors; DMP3 and DMP4. The DMP3 offloads all motion processing tasks from the CPU and provides ready-to-use physical and virtual sensors at ultra-low power, while the DMP4’s processing capabilities complements the CPU by offloading computationally-intensive operations, drastically reducing power consumption. In tandem, the InvenSense ICM-30630 sensor software framework and Cortex-M0 handle vital sensor management tasks via an integrated RTOS and provide an “Open Platform” that is programmable by any OEM allowing for custom software features, ease of programming, and quick time-to-market. The resulting solution supports the acquisition and processing of sensor data from the integrated 6-axis gyroscope and accelerometer, as well as external sensors, which in turn significantly reduces system power consumption and improves ‘AlwaysOn’ performance. The ICM-30630 is fully compliant with Android Lollipop, and other operating systems while supporting multiple application processor platforms.
“InvenSense is expanding its content in the mobile market with the world’s first multi-core 6-axis motion tracking solution with integrated sensor-hub framework software, thus creating a fully autonomous, intelligent sensor SoC,” said Ali Foughi, VP of Marketing and Business Development. “InvenSense’s new platform changes the game by saving the valuable bill of material costs and board real estate, while our open software framework enables rapid time-to-market and unparalleled customer differentiation.”
The ICM-30630 solution is footprint compatible with InvenSense’s existing devices and will sample 1H of CY2015.
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