TDK Introduces Two New High-performance Ultrasonic ToF Sensors Integrating PMUT with an Ultra-low-power SoC

2023-05-29 TDK InvenSense News
high-performance ultrasonic ToF sensors,miniature ultrasonic sensor,ultrasonic time-of-flight sensor,MEMS sensors
  • ICU-10201 and ICU-20201 are high-performance ultrasonic ToF sensors integrating PMUT (Piezoelectric Micromachined Ultrasonic Transducer) with an ultra-low-power SoC (system on chip) in a miniature 3.5×3.5mm² reflowable package.

  • The MEMS sensors provide accurate range measurements at distances up to 5m over a wide and configurable Field-of-View (FoV) on any surface and under any lighting condition.

  • Due to a powerful embedded processor and extended memory space, the sensors deliver high computational power allowing complete application algorithms directly on the chip.


TDK Corporation introduces the Chirp ICU-10201 and ICU-20201, two new high-performance, ultra-low power integrated ultrasonic Time-of-Flightsensors for short- and long-range detection. The new MEMS sensors embed a more powerful on-chip processor with higher computational power. The enhanced processing capabilities allow a wide range of application algorithms to fit and run on-chip, completely offloading the system MCU.


Compared to the previous generation, the ICU-10201 and ICU-20201 embed:

10 times faster DSP with HW multiplier for higher calculation power

3 times larger code memory

2 times larger data memory

A fast host interface (SPI)

Support a wide range of IO supply voltages


“With the introduction of the ICU-10201 and the ICU-20201, TDK continues to expand the SmartSonic™ product family which enhances everyday objects making them greener, safer, and more aware of the surrounding environment,” said Massimo Mascotto, Director of Product Marketing, Chirp, a TDK group company. “In line with the strong shift driven by the recent pandemic, the sensors allow the implementation of touchless control for appliances located in public areas, such as factories, schools, train stations, and airports, thus enabling increased personal safety.”


ICU-20201

The ICU-20201 MEMS sensor provides accurate range measurements to targets up to 5m away.


ICU-10201

The ICU-10201 MEMS sensor provides accurate range measurements to targets up to 1.2m away.


Differentiating from infrared sensors, TDK’s ultrasonic time-of-flight sensor measurements are achieved in any lighting condition, including full sunlight, and provide millimeter-level accuracy, independent of the target’s color and optical transparency.


The ICU-10201 and ICU-20201 in an ultra-compact package footprint of 3.5×3.5mm² are available for immediate sampling. For additional information, please contact sales@invensense.com. TDK will be introducing the two new high-performance ultrasonic ToF sensors during the 2022 CES Virtual Press Conference. 


Glossary

ToF: Time of Flight

FoV: Field of View

EV: Evaluation module

DK: Developer Kit

MEMS: Micro Electrical Mechanical Systems


Key applications

ICU-10201

Augmented/Virtual reality and gaming, gesture control, robotics and drones, obstacle avoidance, floor type, and cliff detection for robotic vacuums, mobile and computing devices, ultra-low power remote presence-sensing nodes, water/liquid dispenser–level sensing


ICU-20201

Robotics and drones, obstacle avoidance, mobile and computing devices, proximity/presence sensing, home/building automation, water/liquid dispenser–level sensing & shelf inventory monitoring


Key features and benefits:

ICU-10201

Second generation high performance, ultra-low power, miniature long-range ultrasonic sensor, operating range 10cm to 1.2m

Works in any lighting condition

Detects objects of any color and optical transparency

Customizable field of view (FoV) up to 180°

3.5×3.5×1.26 mm, 8-pin LGA package


ICU-20201

Second generation high performance, ultra-low power, miniature ultrasonic sensor, operating range 20cm to 5m

Works in any lighting condition

Detects objects of any color and optical transparency

Customizable field of view (FoV) up to 180°

3.5×3.5×1.26 mm, 8-pin LGA package


Key Data

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