Nidec Launches New Semiconductor Wafer Transfer Robot SR7163 Series Accommodating Narrow Pitches of up to the Minimum Limit of 6.5mm
Nidec Instruments Corporation (“Nidec Instruments”), a wholly owned subsidiary of Nidec Corporation, today announced the release of its latest Semiconductor Wafer Transfer Robot.
Nidec Instruments’ Latest Semiconductor Wafer Transfer Robot, SR7163 series
Despite a temporary slowdown in 2023, the global semiconductor market is expected to expand from 2024 after demand recovers in a wide variety of product groups such as memory logic and other IC products, and in the O-S-D (optoelectronics, sensor/actuator, and discrete semiconductor) segment. As the demand grows around the world for the construction of semiconductor factories with high production capacity, Nidec Instruments has developed the SR7163 series, a semiconductor wafer transfer robot to respond to its customers’ needs.
Among semiconductor manufacturing equipment, the SR7163 series is expected to be used in batch-type thermal treatment equipment and other machines in processes that require to transfer of multiple substrates to a stage with a different slot pitch. A product that utilizes an arm-link mechanism to move a hand horizontally, the SR7163 series boasts a small minimum turning radius that can accommodate narrow pitches of up to the minimum limit of 6.5mm. In addition, with the use of a highly airtight link-type arm, the SR7163 series meets ISO14644-1’s Class-1 cleanliness requirements, which is the industry’s highest-level cleanliness.
As a member of the world’s leading comprehensive motor manufacturer, Nidec Instruments stays committed to offering revolutionary solutions that contribute to building a comfortable society.
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