Alliance Memory 4GB and 8GB eMMC Solutions Simplify Designs and Save Space in Consumer and Networking Applications
Jan. 27, 2022 — Alliance Memory today introduced two new industrial-grade embedded multi-media card (EMMC) solutions. For solid-state storage in consumer, industrial, and networking applications, the 4GB ASFC4G31M-51BIN and 8GB ASFC8G31M-51BIN each integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package.
The devices released today are compliant with the JEDEC eMMC v5.1 industry standard, supporting features such as boot operation; replay protected memory block (RPMB); device health report; field firmware updates; power off notification; enhanced strobe features for faster and more reliable operation; write leveling; high-priority interrupt (HPI); secure trim/erase; and high-speed HS200 and HS400 modes. The ASFC4G31M-51BIN and ASFC8G31M-51BIN are also backwards-compatible with eMMC v4.5 and v5.0.
The eMMCs will be used in products such as smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, infotainment, CCTV, surveillance, automation, point-of-sale systems and emerging embedded applications. For designers, the ASFC4G31M-51BIN and ASFC8G31M-51BIN simplify designs for fast and easy system integration in these products — speeding up product development and time to market — while saving space by eliminating the need for an external controller. In addition, the devices’ FTL software provides high reliability and stable performance with wear levelling and bad block management.
The ASFC4G31M-51BIN and ASFC8G31M-51BIN operate over an industrial temperature range of -40°C to +85°C and offer programmable bus widths of x1, x4, and x8. The devices’ NAND memory with internal LDO can be powered with a single 3V supply voltage, while the controller can be powered by 1.8V or 3V dual supply voltages.
Samples and production quantities of the eMMCs will be available in Q1 2022, with lead times of 12 weeks.
- 【Datasheet】ASFC4G31M-51BIN
- 【Datasheet】ASFC4G31M-51BIN high performance embedded MMC solution
- 【Datasheet】ASFC8G31M-51BIN
- 【Datasheet】ASFC8G31M-51BIN eMMC device Datasheet
- 【Datasheet】ASFC8G31M-51BIN high performance embedded MMC solution
- 【Datasheet】ASFC4G31M-51BIN 4GB eMMC 153ball FBGA PACKAGE
- 【Datasheet】ASFC4G31M-51BIN 4GB eMMC 153ball FBGA PACKAGE
- 【Datasheet】ASFC8G31M-51BIN 8GB eMMC 153ball FBGA PACKAGE
- 【Datasheet】ASFC8G31M-51BIN 8GB eMMC 153ball FBGA PACKAGE
- +1 Like
- Add to Favorites
Recommend
- Alliance Memory Introduces Two New Industrial-grade Embedded Multi-media Card (eMMC) Solutions
- Alliance Memory Announces ISO 9001:2015 Recertification
- Alliance Memory 16GB eMMC ASFC16G31M-51BIN in a Single 11.5mm by 13mm 153-ball FBGA Package
- Alliance Memory Expands eMMC Offering With New 32GB, 64GB, and 128GB Solutions
- Alliance Memory Introduces New Line of 1.8V and 3V SPI NAND Flash Memory Solutions
- Alliance Memory 16GB eMMC Solution Simplifies Designs and Saves Space in Consumer, Industrial, and Networking Applications
- Alliance Memory Enhances Its eMMC Lineup, Introducing 5GB and 10GB 3D pSLC Options, Boasting over 30K Cycles of Reliability and Endurance
- Alliance Complete Automotive Temperature DRAM Portfolio, Now With Reduced Lead Times
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.