Reliability Qualification Report for ASFC8G31M-51BIN 8GB eMMC with Pb/Halogen Free (Industrial)
■This report describes the reliability and qualification data of Alliance product listed below.
■The qualification and reliability tests have been completed successfully based on Alliance standard.
●Product and Package Information
■Product Code：ASFC8G31M-51BIN
■Operating Temperature：-40°C to +85°C (Industrial)
■Package Type：FBGA 153B (11.5x13.0mm, 1.0T)
■Flammability：UL-V0
■Solder ball：SAC305 (96.5% Sn / 3.0% Ag / 0.5% Cu)
●Result Summary
■Lifetime Simulation Tests: Passed ELFR & HTOL
■Environment Stress Tests: Passed All Tests
■ESD & Latch-up: Passed HBM 2000V, CDM 500V & Latch-up ±150mA
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Test Report |
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Please see the document for details |
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FBGA 153B |
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English Chinese Chinese and English Japanese |
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April 07, 2022 |
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1 MB |
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