Alliance Memory Expands eMMC Offering With New 32GB, 64GB, and 128GB Solutions
KIRKLAND, Wash. — Sept. 21, 2023 — Alliance Memory introduced new 32GB, 64GB, and 128GB industrial-grade embedded multi-media card (eMMC) solutions. For solid-state storage in consumer, industrial, and networking applications, the ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN integrate high-reliability TLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5mm by 13mm 153-ball FBGA package.
The devices released today are compliant with the JEDEC eMMC v5.1 industry standard, supporting features such as boot operation, replay-protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write leveling, high-priority interrupt (HPI), secure trim/erase, and high-speed HS200 and HS400 modes. The ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN are also backward-compatible with eMMC v4.5 and v5.0.
The eMMCs will be used in products such as smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, CCTV, infotainment, surveillance, automation, point-of-sale systems, and emerging embedded applications. For designers, the ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN simplify designs for fast and easy system integration in these products, speeding up product development and time to market while saving space by eliminating the need for an external controller. In addition, the device’s FTL software provides high reliability and stable performance with wear leveling and bad block management.
“With our latest eMMCs, we’ve extended our offering to include densities from 4GB all the way up to 128GB, providing designers with a wide range of options to meet their mass storage needs and solidifying our position as a leading supplier of eMMC technology,” said David Bagby, president and CEO, Alliance Memory. “Furthermore, with their TLC NAND flash technology, our new 32GB, 64GB, and 128GB solutions deliver even higher reliability, endurance, and performance, while maintaining the same ease of integration as our lower-density devices.”
The ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN operate over an industrial temperature range of -40℃ to +85℃ and offer programmable bus widths of x1, x4, and x8. The device’s NAND memory with internal LDO can be powered with a single 3V supply voltage, while the controller can be powered by 1.8V or 3V dual supply voltages.
Samples of the eMMCs are available now. Production quantities are available with lead times of eight to 10 weeks.
- +1 Like
- Add to Favorites
Recommend
- Alliance Memory Announces ISO 9001:2015 Recertification
- Alliance Memory 16GB eMMC ASFC16G31M-51BIN in a Single 11.5mm by 13mm 153-ball FBGA Package
- Alliance Memory Introduces Two New Industrial-grade Embedded Multi-media Card (eMMC) Solutions
- Alliance Memory 4GB and 8GB eMMC Solutions Simplify Designs and Save Space in Consumer and Networking Applications
- Alliance Memory 16GB eMMC Solution Simplifies Designs and Saves Space in Consumer, Industrial, and Networking Applications
- Alliance Memory Introduces New Line of 1.8V and 3V SPI NAND Flash Memory Solutions
- Alliance Complete Automotive Temperature DRAM Portfolio, Now With Reduced Lead Times
- Alliance rounds out DDR4 SDRAM Lineup with six new 4Gb “A” die devices, which offer lower +1.2V operating voltages and higher speeds to 1600MHz in 96 and 78-Ball FBGA packages
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
