Heat Dissipation Requirements of Electronic Components and Application of Thermally Conductive Materials
The temperature has a great impact on electronic components. For example, mobile phones freeze due to high temperatures, hosts black screens due to high temperatures, and servers cannot normally enter the company’s website due to high temperatures. The heat conduction effect in the air is very poor, so electronic components are easily accumulated on the surface of the component, so it is necessary to use a heat sink to dissipate heat.
A common heat dissipation device is a heat dissipation and cooling system composed of heat pipes, heat sinks, and fans. The contact piece of the heat pipe contacts the electronic component, conducts heat to the contact piece of the heat pipe, and then conducts it to the outside, thereby rapidly reducing the electronic component's temperature. In addition to the use of heat dissipation devices, the use of thermally conductive materials is also essential.
There is a gap between the electronic component and the heat sink. When the heat is conducted, it will be resisted by the air to reduce the conduction rate. Thermally conductive material is a general term for materials coated between the heat-generating device and the heat sink and reduces the contact thermal resistance between the two. After using the thermally conductive material, the gap between the two can be effectively filled and the air in the gap can be removed, thereby improving the operating environment of the electronic components.
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