ThermoFill TF2619 High Thermally Conductive Interface Filling Material

PublishTime：2025-03-16

ThermoFill TF2619 is a high thermally conductive interface filling material from United Adhesives. It is a non-slump, addition-curing, one-component silicone that cures at room temperature or elevated temperature to a very soft rubber with excellent thermal conductivity. The cured material provides very low thermal stress for thermal cycles. TF2619 is dispensable and printable, offering features like high thermal conductivity, constant properties from -70 to 180°C, very low modulus for stress compliance, low bleeding, and low volatility. It includes a pre-added 7 mil glass bead for thickness control. Typical applications include automotive electronics, semiconductor and telecommunications, and as an interface material between high heat power devices and heat sinks.

Brand of Product：	United Adhesives
Part#：	ThermoFill TF2619 More Part#
Product Category：	High Thermally Conductive Interface Filling Material More
Application：	[ Automotive electronics ][ Semiconductor and Telecommunications ][ High heat power device and heat sink interface ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	02-15-2007
Version Number：	1.07
Data Encoding：	THERMOFILL TF2619
Data Size：	31 KB

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