ThermoFill TF2620 - High Thermally Conductive & High Purity Interface Filling Material

PublishTime：2025-03-16

ThermoFill TF2620 is a high purity, non-slump, addition-curing, one-component interface gap filling material with very high thermal conductivity. It is designed for applications requiring excellent thermal management and electrical insulation. TF2620 cures quickly at elevated temperatures to a soft rubber with low thermal stress, making it suitable for automotive electronics, semiconductor and telecommunications, and high heat power devices. The material is dispensable and printable, with a shelf life of at least 3 months when stored below 4°C in its original sealed container.

Brand of Product：	United Adhesives
Part#：	ThermoFill TF2620 More Part#
Product Category：	Interface Filling Material More
Application：	[ Automotive electronics ][ Semiconductor and Telecommunications ][ High heat power devices and heat sinks ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	05-12-2011
Version Number：	1.04
Data Encoding：
Data Size：	32 KB

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