Thermal Grease TG2730 High Thermally Conductive Interface Filling Compound

PublishTime：2025-03-16

TG2730是由高纯度氮化硼作为填料制成的硅脂，具有优异的热传导性。该化合物在热循环中提供非常低的热应力，且无需固化。TG2730具有几乎恒定的性能，从-70°C到180°C，无应力，低泄漏，低挥发。适用于汽车电子、半导体和电信行业，可用于高热功率器件与散热器之间的热耦合，以及散热过程中的热应力耦合。

Brand of Product：	United Adhesives
Part#：	TG2730 More Part#
Product Category：	热膏 More
Application：	[ 汽车电子 ][ 半导体 ][ 电信 ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	12-31-2006
Version Number：	1.00
Data Encoding：	THERMAL GREASE TG2730
Data Size：	29 KB

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