Shindengen Announces 4 New Models of EETMOS4 of Power MOSFET Based on AEC-Q101

PublishTime： 2020-08-30 Article Source：Shindengen

Shindengen Electric Manufacturing Co., Ltd. has added four new models to its EETMOS4 Series lineup of power MOSFET based on automotive application reliability standard AEC-Q101. This series realizes low loss and large current capacity in a 5×6 mm size compact package, greatly contributing to reduced size and higher efficiency in various motor drive circuits, power supply circuits, relay related and other applications.

In addition, the series also utilizes gull-wing shaped package terminals to achieve high reliability mounting for vehicle applications.
Samples of the four new models in the series are available from June 2020, with mass production slated to begin in December.

■Overview

Recently, Electric Vehicles are about to go mainstream swiftly under the stricter regulations related to environmental awareness.
Some applications mechanically controlled, for instance, water pumps and oil pumps could be powered by electric motors nowadays to minimize energy loss and improve efficiency. In this way, the market demand for electrification has been increasing and consequently design engineers require downsizing, higher performance of power semiconductors as a key building block in the system.
Shindengen has announced a new range of Power MOSFET with automotive grade AEC-Q101 standard, 40V-120V in compact package, following the market trends and needs.
The new lineup with 4^th generation power MOSFET (EETMOS4) optimal die and cu-clip compact package reduces 40%^*1 on-state resistance (R_DS(on)), 52%*1 footprint, which brings both downsizing and higher efficiency in the entire electric system.
Design engineers also benefit from new EETMOS series to get high mounting reliability for automotive applications. New EETMOS series offers strong solderability and robust solder fillet by means of its plating and gull-wing leads structure to fulfill the exact requirement of automotive quality level.

*1: Compared to previous our products

■Features

1: New structure 4th generation power MOSFET
　　Reduces mounting area by 52%, achieving a compact size of 5×6 mm. Also reduces on resistance by 40%^*2.
2: Utilizes a Cu clip structure
　　Achieves reduced size and reduced Ron through a substantial shift to low resistance and improved heat dissipation.
3: Gull-wing shaped leads
　　Alleviates substrate stress while plating of the terminal tip provides higher reliability with vehicle applications.
4: Can be used to replace existing packages
　　Similar external size and shape to SOP8 and HSON series packages allows for easy replacement.
5: Based on AEC-Q101 / Tj=175℃ guaranteed

*2: Total value of electrical resistance reduction resulting from connection structure.

■ Applications

・Various motor drive circuits - fan motors, water pumps, oil pumps, windshield wipers, etc.
・Various power supplies - LED headlights, ECU booster circuits, etc.
・Relays, Reverse protection applications
・BMS (Battery Management Systems)

■ EETMOS4 New Model Product Specifications

■ External Dimensions and Equivalent Circuit

■ Availability

Samples of the four new models are available from June 2020, with mass production slate to begin in December 2020.

■ Factory location

Higashine Shindengen Co.,Ltd.(JPN) etc.

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