TAZ Series CWR09 - MIL-PRF-55365/4 Established Reliability, COTS-Plus & Space Level
2019-08-18
This is the original high reliability molded
tantalum chip series and the case sizes still
represent the most flexible of surface mount
form factors. TAZ offers nine case sizes, eight of
which (A through H) are fully qualified to MILPRF-55365/4,
and also includes the original
sub-miniature R case (non-QPL).
This series is fully interchangeable with CWR06
conformal types, while offering the advantages of
molded body/compliant termination construction
(ensuring no TCE mismatch with any substrate).
This construction is compatible with a wide range
of SMT board assembly processes including wave
or reflow solder, conductive epoxy or compression
bonding techniques.
The parts also carry full polarity and
capacitance / voltage marking. The five smaller
cases are characterized by their low profile
construction, with the A case being the world’s
smallest molded military tantalum chip.
All 4V to 50V ratings are qualified to
MIL-PRF-55365 Weibull “B”, “C”, “D” and “T”
levels, with all surge options (“A”, “B” & “C”)
available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
An extended range of capacitor ratings beyond
CWR09 that is fully qualified to MIL-PRF55365/11,
this series represents the most
flexible of surface mount form factors, offering
nine case sizes (the original A through H of
CWR09) and adds the new X case size.
The molded body / compliant termination
construction ensures no TCE mismatch with any
substrate. This construction is compatible with a
wide range of SMT board assembly processes
including wave or reflow solder, conductive
epoxy or compression bonding techniques. The
parts also carry full polarity and capacitance /
voltage marking.
The four smaller cases are characterized by their
low profile construction, with the A case being the
world’s smallest molded military tantalum chip.
The series is qualified to MIL-PRF-55365 Weibull
“B”, “C”, “D” and “T” levels, with all surge
options (“A”, “B” & “C”) available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
A low ESR version of CWR09 and CWR19 that
is fully qualified to MIL-PRF-55365/11, the
CWR29 series represents the most flexible of surface
mount form factors and the optimum power
handing for all filtering applications. It is offered in
nine case sizes (the original A through H of
CWR09 and adding the new X case size).
The molded body / compliant termination construction
ensures no TCE mismatch with any substrate.
This construction is compatible with a wide
range of SMT board assembly processes including
wave or reflow solder, conductive epoxy or
compression bonding techniques. The parts also
carry full polarity and capacitance / voltage marking.
The five smaller cases are characterized by their
low profile construction, with the A case being the
world’s smallest molded military tantalum chip.
The series is qualified to MIL-PRF-55365 Weibull
“B”, “C”, “D” and “T” levels, with all surge options
(“A”, “B” & “C”) available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table for
part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
tantalum chip series and the case sizes still
represent the most flexible of surface mount
form factors. TAZ offers nine case sizes, eight of
which (A through H) are fully qualified to MILPRF-55365/4,
and also includes the original
sub-miniature R case (non-QPL).
This series is fully interchangeable with CWR06
conformal types, while offering the advantages of
molded body/compliant termination construction
(ensuring no TCE mismatch with any substrate).
This construction is compatible with a wide range
of SMT board assembly processes including wave
or reflow solder, conductive epoxy or compression
bonding techniques.
The parts also carry full polarity and
capacitance / voltage marking. The five smaller
cases are characterized by their low profile
construction, with the A case being the world’s
smallest molded military tantalum chip.
All 4V to 50V ratings are qualified to
MIL-PRF-55365 Weibull “B”, “C”, “D” and “T”
levels, with all surge options (“A”, “B” & “C”)
available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
An extended range of capacitor ratings beyond
CWR09 that is fully qualified to MIL-PRF55365/11,
this series represents the most
flexible of surface mount form factors, offering
nine case sizes (the original A through H of
CWR09) and adds the new X case size.
The molded body / compliant termination
construction ensures no TCE mismatch with any
substrate. This construction is compatible with a
wide range of SMT board assembly processes
including wave or reflow solder, conductive
epoxy or compression bonding techniques. The
parts also carry full polarity and capacitance /
voltage marking.
The four smaller cases are characterized by their
low profile construction, with the A case being the
world’s smallest molded military tantalum chip.
The series is qualified to MIL-PRF-55365 Weibull
“B”, “C”, “D” and “T” levels, with all surge
options (“A”, “B” & “C”) available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
A low ESR version of CWR09 and CWR19 that
is fully qualified to MIL-PRF-55365/11, the
CWR29 series represents the most flexible of surface
mount form factors and the optimum power
handing for all filtering applications. It is offered in
nine case sizes (the original A through H of
CWR09 and adding the new X case size).
The molded body / compliant termination construction
ensures no TCE mismatch with any substrate.
This construction is compatible with a wide
range of SMT board assembly processes including
wave or reflow solder, conductive epoxy or
compression bonding techniques. The parts also
carry full polarity and capacitance / voltage marking.
The five smaller cases are characterized by their
low profile construction, with the A case being the
world’s smallest molded military tantalum chip.
The series is qualified to MIL-PRF-55365 Weibull
“B”, “C”, “D” and “T” levels, with all surge options
(“A”, “B” & “C”) available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table for
part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
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