TAZ Series CWR29 - MIL-PRF-55365/11 Established Reliability, COTS-Plus & Space Level
2019-08-18
A low ESR version of CWR09 and CWR19 that
is fully qualified to MIL-PRF-55365/11, the
CWR29 series represents the most flexible of surface
mount form factors and the optimum power
handing for all filtering applications. It is offered in
nine case sizes (the original A through H of
CWR09 and adding the new X case size).
The molded body / compliant termination construction
ensures no TCE mismatch with any substrate.
This construction is compatible with a wide
range of SMT board assembly processes including
wave or reflow solder, conductive epoxy or
compression bonding techniques. The parts also
carry full polarity and capacitance / voltage marking.
The five smaller cases are characterized by their
low profile construction, with the A case being the
world’s smallest molded military tantalum chip.
The series is qualified to MIL-PRF-55365 Weibull
“B”, “C”, “D” and “T” levels, with all surge options
(“A”, “B” & “C”) available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table for
part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
is fully qualified to MIL-PRF-55365/11, the
CWR29 series represents the most flexible of surface
mount form factors and the optimum power
handing for all filtering applications. It is offered in
nine case sizes (the original A through H of
CWR09 and adding the new X case size).
The molded body / compliant termination construction
ensures no TCE mismatch with any substrate.
This construction is compatible with a wide
range of SMT board assembly processes including
wave or reflow solder, conductive epoxy or
compression bonding techniques. The parts also
carry full polarity and capacitance / voltage marking.
The five smaller cases are characterized by their
low profile construction, with the A case being the
world’s smallest molded military tantalum chip.
The series is qualified to MIL-PRF-55365 Weibull
“B”, “C”, “D” and “T” levels, with all surge options
(“A”, “B” & “C”) available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table for
part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
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