AD250C TFE/Woven Fiberglass/Micro-Dispersed Ceramic FilledLaminate for RF & Microwave Printed Circuit Boards
microwave and RF laminate material designed with low
dielectric, low cost and excellent low loss characteristics.
AD250C is built on a cost-effective combination of
composite chemistry and construction to yield an
uncompromising level of price-performance for today’s
telecommunication infrastructure.
AD250C combines the superior thermal properties of a
fluoropolymer resin system with selected ceramic materials
and fiberglass reinforcement to yield a laminate material with
lower loss (Df=0.0014 at 10GHz), lower thermal expansion
properties and lower passive intermodulation (PIM). AD250C
also represents further improvements over Arlon’s AD250A
product in terms of cost.
Stability of PTFE over wide frequency and temperature
ranges with low loss properties, makes AD250C ideal for a
variety of microwave and RF applications in telecom
infrastructure. The inclusion of micro-dispersed ceramic
provides thermal stability to the laminate in the form of lower
CTE values and greater phase stability across temperatures.
The net combination of properties of AD250C are highly
desired in applications where higher frequency and
expectations for longevity in material performance for high
gain and broadband signals, which are typically beyond the
performance capabilities offered by low loss thermosets.
AD250C is compatible with the processing used for standard
PTFE based printed circuit board substrates. Its low Z-axis
thermal expansion improves plated through-hole (PTH)
reliability compared to typical PTFE based laminates. Low
X-Y expansion improves BGA solder-joint reliability.
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[ Base Station Antenna Applications ][ Commercial Antennas ][ Digital Audio Broadcasting (DAB) Antennas (Satellite Radio) ][ Radar Manifolds and Feed Networks ] |
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Datasheet |
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UL 94 V-0 |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2016/12/01 |
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942 KB |
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