Bluetooth Module Datasheet

PublishTime：2025-03-19

The SJR-BTM324 is a high-performance, cost-effective, low-power, and compact Bluetooth 5.1 module developed by Sky Jiarun Technologies Co., Ltd. It is based on the QCC3024 BGA chipset, which is a single-chip radio and baseband IC for Bluetooth 2.4GHz systems. The module is a fully qualified single-chip dual mode Bluetooth v5.1 system, offering features such as 120 MHz Qualcomm Kalimba audio DSPs, 32 MHz developer processor, firmware processor, flexible QSPI flash programmable platform, advanced audio algorithms, high-performance 24-bit stereo audio interface, digital and analog microphone interfaces, SBC and AAC audio codecs support, and various serial interfaces. It is suitable for applications such as wired/wireless stereo headsets/headphones, Qualcomm TrueWireless stereo earbuds, and USB to Bluetooth dongles.

Brand of Product：	天嘉润科技
Part#：	SJR-BTM324 More Part#
Product Category：	Bluetooth Module More
Application：	[ Wired/wireless stereo headsets/headphones ][ Qualcomm TrueWireless stereo earbuds ][ USB to Bluetooth dongle ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2021-11-21
Version Number：	V1.3
Data Encoding：	Doc: BTM324
Data Size：	663 KB

Data section preview(2pages)

- The full preview is over. If you want to read the whole 12 page document,please Sign in/Register -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits