Bluetooth Module Datasheet

PublishTime：2025-03-19

This datasheet provides detailed information about the SJR-BTM386 Bluetooth module, a high-performance, cost-effective, low-power, and compact solution for 2.4GHz Bluetooth systems. The module is based on the QCC3086 WLCSP chipset and is fully qualified for Bluetooth v5.3 specification. It features a dual-core application subsystem, advanced audio algorithms, and support for various serial interfaces. The module is suitable for USB dongles and source devices. The datasheet includes general specifications, module package information, electrical characteristics, and recommended reflow temperature profile.

Brand of Product：	天嘉润科技
Part#：	SJR-BTM386 More Part#
Product Category：	Bluetooth Module More
Application：	[ USB dongles and source devices ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	WLCSP
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2023-02-01
Version Number：	V1.0
Data Encoding：	Doc: BTM386_V1.0
Data Size：	609 KB

Data section preview(2pages)

- The full preview is over. If you want to read the whole 13 page document,please Sign in/Register -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits