Bluetooth Module Datasheet

PublishTime：2025-03-19

The SJR-BTM356 is a high-performance, cost-effective, low-power, and compact Bluetooth 5.3 module developed by Sky Jiarun Technologies Co., Ltd. It is based on the QCC3056 WLCSP chipset, which is a single-chip radio and baseband IC for Bluetooth 2.4GHz systems. The module is fully qualified for the Bluetooth v5.3 specification and includes dual 120 MHz Qualcomm® Kalimba™ audio DSPs, a 32/80 MHz developer processor, and a firmware processor for the system. It features a flexible QSPI flash programmable platform, high-performance 24-bit audio interface, digital and analog microphone interfaces, and supports advanced audio algorithms and active noise cancellation. The module also includes an integrated PMU with dual SMPS for system/digital circuits and an integrated Li-ion battery charger. The application subsystem features a dual-core application subsystem with 32/80 MHz operation, and the Bluetooth subsystem is qualified for Bluetooth v5.3, including 2 Mbps Bluetooth Low Energy and Bluetooth Low Energy Isochronous Channels. The module supports Qualcomm® Bluetooth High Speed Link and offers single-ended antenna connection with on-chip balun and Tx/Rx switch.

Brand of Product：	天嘉润科技
Part#：	SJR-BTM356 More Part#
Product Category：	Bluetooth Module More
Application：	[ Qualcomm TrueWireless™ stereo earbuds ][ USB Dongle ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	Not specified in the provided text
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2022-04-07
Version Number：	V1.2
Data Encoding：	Not specified in the provided text
Data Size：	661 KB

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