Heavy-Wire Wedge Bonder 5850

2025-03-16
The Heavy-Wire Wedge Bonder 5850 is a programmable bond system designed for bonding heavy wires, such as aluminium wire (100-500µm) and copper wire (100-300µm). It features a voice-oil bond force system with a range from 0 up to 1.800 cN and an optional motorized wire despooler. The ultrasonic system operates at 60 kHz. The bonder base includes a working area of 200 x 150 mm with programmable step resolution of 1μm and a Z axis with 100 mm stroke. It is equipped with a dual-core PC with Windows OS, Ethernet, USB 2.0/3.0, and a 22” colour display. The machine is fully networkable and suitable for R&D, pilot, and middle volume production.

F&S BONDTEC

5850

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Part#

Wire Bonding Equipment

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Semiconductor manufacturing ]R&D ]Pilot ]middle volume production ]

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Supplier and Product Introduction

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