Universal automatic Bonder & Tester 5600Ci

PublishTime：2025-03-16

The 5600Ci is a fully automatic bonder and tester designed for semiconductor die and wire bonding applications. It features programmable bonding and testing capabilities, with a range of testheads for pull and shear testing. The system includes a dual-core PC with Windows OS, Ethernet, USB 2.0/3.0, and a GigE-CMOS-Color camera. The software offers automatic repeat measurements, pattern recognition, and statistical analysis. The 5600Ci is capable of rapid conversion ranges and high accuracy measurements.

Brand of Product：	F&S BONDTEC
Part#：	5600Ci More Part#
Product Category：	Bond tester More
Application：	[ Semiconductor die and wire bonding ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：
Version Number：
Data Encoding：
Data Size：	454 KB

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