T-4909-AE

PublishTime：2025-03-16

The T-4909-AE anniversary edition is a manual die bonder designed for budget-sensitive applications with an emphasis on ergonomic design. It features True Vertical Technology™, ensuring parallelism between the chip and substrate at any bond height. The system is equipped with an integrated Raspberry Pi PC and touchscreen for intuitive programming of bonding parameters and sequences. The T-4909-AE supports various bonding applications such as epoxy, eutectic, and flip-chip, and is suitable for small and medium volume production in industries like die attach, flip-chip, MEMS, MOEMS, VCSEL, RFID, adhesive bonding, and eutectic bonding.

Brand of Product：	TRESKY
Part#：	T-4909-AE More Part#
Product Category：	Die Bonder More
Application：	[ Die Attach ][ Flip-Chip ][ MEMS ][ MOEMS ][ VCSEL ][ RFID ][ Adhesive Bonding ][ Eutectic Bonding ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：
Version Number：
Data Encoding：
Data Size：	3.8 MB

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