2409111565 Die attach material change for EFM32GG11x/12x (BGA-10x10) Process Change Notice

PublishTime：2024-09-24

■Description of Change
●Silicon Labs is pleased to announce the change of die attach material from Henkel Ablebond 2025D epoxy to Henkel ATB- F125E DAF for all EFM32GG11 & EFM32GG12 (112-LFBGA-10x10) devices.
●As of the effective date of this notification, Silicon Labs will fulfill orders using materials built with either Henkel Ablebond 2025D epoxy or Henkel ATB-F125E DAF. Once the current materials built with epoxy are depleted, orders will be 100% fulfilled with the materials built with DAF.
■Reason for Change
●To qualify a new die attach material.
■Impact on Form, Fit, Function, Quality, Reliability
●There is no impact on form, fit, function, Quality or Reliability.

Brand of Product：	Silicon Labs
Part#：	EFM32GG11 、 EFM32GG12 、 EFM32GG11B310F2048GL112-B 、 EFM32GG11B310F2048GL112-BR 、 EFM32GG11B320F2048GL112-B 、 EFM32GG11B320F2048GL112-BR 、 EFM32GG11B420F2048GL112-B 、 EFM32GG11B420F2048GL112-BR 、 EFM32GG11B420F2048IL112-B 、 EFM32GG11B420F2048IL112-BR 、 EFM32GG12B310F1024GL112-A 、 EFM32GG12B310F1024GL112-AR 、 EFM32GG12B330F512GL112-A 、 EFM32GG12B330F512GL112-AR 、 EFM32GG12B410F1024GL112-A 、 EFM32GG12B410F1024GL112-AR 、 EFM32GG12B410F1024IL112-A 、 EFM32GG12B410F1024IL112-AR 、 EFM32GG12B430F512GL112-A 、 EFM32GG12B430F512GL112-AR 、 EFM32GG12B430F512IL112-A 、 EFM32GG12B430F512IL112-AR 、 EFM32GG12B510F1024GL112-A 、 EFM32GG12B510F1024GL112-AR 、 EFM32GG12B510F1024IL112-A 、 EFM32GG12B510F1024IL112-AR 、 EFM32GG12B530F512GL112-A 、 EFM32GG12B530F512GL112-AR 、 EFM32GG12B530F512IL112-A 、 EFM32GG12B530F512IL112-AR 、 EFM32GG12B810F1024GL112-A 、 EFM32GG12B810F1024GL112-AR 、 EFM32GG12B810F1024IL112-A 、 EFM32GG12B810F1024IL112-AR 、 EFM32GG12B830F512GL112-A 、 EFM32GG12B830F512GL112-AR 、 EFM32GG12B830F512IL112-A 、 EFM32GG12B830F512IL112-AR 、 EFM32GG11x 、 EFM32GG12x More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	Sep 11, 2024
Version Number：
Data Encoding：	2024-09-11-1565;2409111565
Data Size：	1 MB
Effective Date：	Dec 17, 2024
PCN Type：	Assembly

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