Product Samples ATP1020: Plated Cu Samples
●Applied Thin-Film Products (ATP) is pleased to provide ceramic thin-film samples for your evaluation.
●TiW/Au/Cu/Ni/Au metalization on Aluminum Oxide (Al2O3) that is used as a high conductivity film that may require Pb/ Sn soldering. Combined copper and nickel can be plated as thick as 0.001" or 25.4μm.
●ATP1020: Material is 15 mil As-Fired Al2O3
■TiW = 600–800 Ångströms
■Au = 120μ" minimum
■Cu = 400μ" minimum
■Ni = 20μ" minimum
■Au = 40μ" maximum
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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200521 |
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Version 200521 |
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280 KB |
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