Passive Component Advancements for SPE Connectors and Circuit Protection Devices TECHNICAL PAPER

PublishTime：2024-04-24

●Abstract
■As Single Pair Ethernet (SPE) begins to roll out there will be a need for easy to implement, yet reliable wire-to-board interconnects. Purchasing finished cable and connector assemblies is not always economical or viable. However, it is also undesirable to work with time consuming and difficult to process connectors. Insulation Displacement Connectors (IDC) and Press-Fit technology (images below) require no crimping or soldering processes, and is easily converted to a streamlined process, while maintaining the versatility of cable lengths and positioning. In addition to reliable retention forces and gas tight seals afforded by the cold weld mechanism of IDC, signal integrity is preserved and performs beyond transmission standards set for SPE connectors.
●CONCLUSION
■In summary, Insulation Displacement Connectors (IDC) excel at wire-to-board assembly speed and simplicity due to their design requiring no wire preparation like clamping or soldering terminations on wires. Press-Fit connectors have excellent board placement versatility due to their short pin lengths that have high retention forces and no soldering requirements making it convenient for boards going through multiple reflows and prevents connectors from undergoing multiple temperature cycles. There are SPE connectors, like the 6780 Series of devices, that utilize both IDC and Press-Fit technology to accommodate designers with unique termination options for size and time constrained assemblies which may provide opportunities for cost reductions compared to other connector types.
■It was also discussed that MLVs provide a strong alternative to TVS diodes for circuit protection due to the ongoing silicon shortage which is projected to impact the TVS diode industry. But in addition to availability, MLVs are capable of surviving highly repetitive strikes, require no temperature derating, can be designed for low capacitance loading for high frequency signal lines, and are extremely volumetrically efficient when compared to TVS diodes. SPE networks on automated assembly lines, robotics, or Industrial IoT applications, will certainly have EMI requirements along with circuit protection, and MLVs have intrinsic capacitance which can be used during nominal operation as an EMC capacitor. This means a traditional TVS diode(s) + MLCC(s) combination can be consolidated into one MLV device that performs both filtering during normal operation and clamping in the event of a transient. As SPE picks up steam, solderless process connectors and Ethernet qualified MLV arrays will be able to support unique design constraints.

Brand of Product：	KYOCERA
Part#：	SMAJ33CA 、 SMxJ Series 、 SMxJ 、 6780 Series 、 6780 More Part#
Product Category：	SPE Connectors 、 multilayer varistor 、 MLV 、 TVS diode 、 Diode 、 Auto Grade MLV 、 IDC 、 PRESS-FIT CONNECTORS 、 Low Clamp Automotive TransGuard MLV 、 Transient Voltage Suppression Diode 、 Auto Grade Diode 、 Insulation Displacement Connectors More
Application：	[ industrial applications ][ automated assembly lines ][ robotics ][ Industrial IoT applications ][ automotive applications ] More
Data Type：	Technical Documentation More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	0805;0603;0402
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2023/3/7
Version Number：
Data Encoding：
Data Size：	1.5 MB

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