5.0SMDJxxS Series Single Chip Design
2024-01-31
●Description
■The 5.0SMDJxxS series, single chip design is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.
●Features
■5000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
■Recognized to UL 497B as an Isolated Loop Circuit Protector
■DO214AB SMT package for minimized board space
■Low profile package
■Typical failure mode is short from over-specified voltage or current
■Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
■ESD protection of data lines in accordance with IEC 61000- 4-2, ESD 30kV (Air), 30kV (Contact)
■EFT protection of data lines in accordance with IEC 61000- 4-4
■Built-in strain relief
■Glass passivated chip junction
■Very fast response time
■Excellent clamping capability
■Low incremental surge resistance
■Typical IR less than 2μA when VBR min>12V
■High temperature to reflow soldering guaranteed: 260°C/10sec
■VBR @ TJ= VBR@25°C x (1+T x (TJ - 25))(T:Temperature Coefficient)
■UL Recognized compound meeting flammability rating V-0
■Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
■Matte tin lead–free plated
■Halogen free and RoHS compliant
■Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD- 609A.01)
■The 5.0SMDJxxS series, single chip design is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.
●Features
■5000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
■Recognized to UL 497B as an Isolated Loop Circuit Protector
■DO214AB SMT package for minimized board space
■Low profile package
■Typical failure mode is short from over-specified voltage or current
■Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
■ESD protection of data lines in accordance with IEC 61000- 4-2, ESD 30kV (Air), 30kV (Contact)
■EFT protection of data lines in accordance with IEC 61000- 4-4
■Built-in strain relief
■Glass passivated chip junction
■Very fast response time
■Excellent clamping capability
■Low incremental surge resistance
■Typical IR less than 2μA when VBR min>12V
■High temperature to reflow soldering guaranteed: 260°C/10sec
■VBR @ TJ= VBR@25°C x (1+T x (TJ - 25))(T:Temperature Coefficient)
■UL Recognized compound meeting flammability rating V-0
■Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
■Matte tin lead–free plated
■Halogen free and RoHS compliant
■Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD- 609A.01)
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