CollTech Chip Protection Solution
■Chips are the core brains of electronic products. Without glue protection, the solder bumps between chip and PCBs may crack due to drops, distortions, and collisions, thus resulting in the failure of the overall electrical function. At present, there are various types of computer chips, with different sizes and pitches. CollTech Edgebond products are developed and designed to provide excellent protection in a plent of applications especially for large size chips. However, Edgebond material has aslo obvious advantages over underfill which has limited flow, filling and higher cost. In the application of smaller chips, underfill is more widely used featuring as its’higher reliability of protecting the chip than Edgebond solution.
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[ Chip Protection ][ computer chips ] |
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Supplier and Product Introduction |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/7/11 |
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1 MB |
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