EW 6330 One-part thermal curing epoxy
●EW 6330 is a one-part, solvent free epoxy. It can be cured at low temperatures and provide excellent bonding strength to various substrates.
■Features:
●Recommended substrates: glass, aluminum, stainless steel, FPC and PCB
●Low temperature curing
●Fast curing speed
|
|
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
10/22/2021 |
|
|
Version 1 |
|
|
|
|
|
569 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
