EW 6330 thermal curing epoxy adhesive
■EW 6330 is a one-part, solvent free, thermal curing adhesive based on epoxy system.
■It is designed for bonding or reinforcing of electronic components.
●Key Features
■Excellent adhesion to a variety of substrates, such as: FPC, PCB, etc.
■Easy to apply via various processes: automatic/manual dispensing, etc.
■Excellent resistance to mechanical shock or vibration
■Thixotropic with good controlled flowability
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thermal curing epoxy adhesive 、 one-part, solvent free, thermal curing adhesive |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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02/2023 |
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162 KB |
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