Tflex™ HD7.5 Series Thermal Gap Filler
●PRODUCT DESCRIPTION
■Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™ HD7.5 is designed to provide superior pressure versus deflection characteristics. The material will provide minimal stress on components during application while maintaining low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
■Tflex™ HD7.5 gap filler is available in thickness from 1mm (0.040”) to 5mm (0.200”). Laird can provide material to meet your production needs in any region through our local production facilities. Please contact your local Laird sales or field engineering contact for samples or questions.
●FEATURES AND BENEFITS
■7.5 W/mK thermal conductivity
■Low pressure versus deflection
■Minimizes board and component stress
■Low Outgassing and oil bleeding
■Large tolerance applications
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HD7.5 Series 、 HD7.5 、 Tflex™ HD7.5 、 Tflex™ HD7.5 Series 、 Tflex™ HD7.5,1.00 |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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06122023 |
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THR-DS-Tflex™ HD7.5 06122023 |
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330 KB |
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