Tflex™ HD7.5 Series Thermal Gap Filler
■Laird's Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™ HD7.5 is designed to provide superior pressure versus deflection characteristics. The material will provide minimal stress on components during application while maintaining low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
■Tflex™ HD7.5 gap filler is available in thickness from 1mm (0.040") to 5mm (0.200"). Laird can provide material to meet your production needs in any region through our local production facilities.
●FEATURES AND BENEFITS
■7.5 W/mK thermal conductivity
■Low pressure versus deflection
■Minimizes board and component stress
■Low Outgassing and oil bleeding
■Large tolerance applications
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Tflex™ HD7.5 Series 、 Tflex™ HD7.5 、 Tflex™ HD7.5,1.00 、 Tflex™ HD7.5,1.00,A1 |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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09152022 |
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324 KB |
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