FGM230S Proprietary SiP Module Data Sheet

2023-02-03
●The FGM230S is a system-in-package (SiP) module for Proprietary wireless connectivities built for the performance, security, and energy demands of Proprietary applications.
●Based on the EFR32FG23 SoC, it delivers robust RF performance, long-range, industry-leading security features, low-current consumption, a rich set of MCU peripherals, and sample memory, all in a 6.5 x 6.5 mm package.
●The FGM230S is a complete solution supported by powerful and fully-upgradeable
software, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your end-product, helping to accelerate its time-to-market significantly.
●KEY FEATURES
■Proprietary uncertified connectivity
■RF pin for external antenna
■+14 dBm TX power
■-109.8 dBm RX sensitivity @100 kbps
■32-bit ARM Cortex-M33 core at 39 MHz
■512/64 kB of Flash/RAM memory
■Advanced security features
■Rich set of MCU peripherals
■Integrated DC-DC converter
■34 GPIO pins
■-40 to 85 °C
■6.5 mm x 6.5 mm

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FGM230SFGM230SA27HGN3FGM230SB27HGN3FGM230S-RB4328AFGM230S-RB4328B

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Proprietary SiP Modulesystem-in-package moduleSiP module

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Metering ]Home Automation ]Building Automation ]Security ]Industrial Automation ]Street Lighting ]

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July, 2022

Rev. 1.0

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