BGAE540| eMMC | 153-ball/100-ball
■SMART's BGAE540 eMMC is compliant to eMMC v5.1 specifications and is available in the standard JEDEC 0.5mm pitch, 153-ball BGA package, as well 1.0mm pitch, 100-ball BGA package. The 100-ball package offers larger ball pitch and ball diameter enabling lower cost PCB designs and simplifies PCB routing with wider metal traces.
■Features & Benefits
▲Compliant to JEDEC v5.1 Standard
▲BGAE540 SE: Base eMMC, TLC NAND with Capacities from 16GB to 128GB
▲BGAE540 UE: Pre-configured to pSLC Enhanced Storage Media Mode with User Capacities from 5GB to 40GB
▲Industrial Temp (-40°C to +85°C)
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BGAE540 、 BGAE540 SE 、 BGAE540 UE 、 SP9MDGP3AMI01 、 SP9MCGP3AMI01 、 SP9MBGP3AMI01 、 SP9MAGP3AMI01 、 SP9QDGP3AMI01 、 SP9QCGP3AMI01 、 SP9QBGP3AMI01 、 SP9QAGP3AMI01 、 SP9MDGP3AMI11 、 SP9MCGP3AMI11 、 SP9MBGP3AMI11 、 SP9MAGP3AMI11 、 SP9QDGP3AMI11 、 SP9QCGP3AMI11 、 SP9QBGP3AMI11 、 SP9QAGP3AMI11 |
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[ Factory Automation ][ IIoT ][ Medical Devices ][ Networking Appliances ][ POS Terminals ][ RFID Scanners ][ Single-Board Computers ][ Telecom Infrastructure ] |
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Datasheet |
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Please see the document for details |
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BGA |
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English Chinese Chinese and English Japanese |
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01.07.22 |
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Rev.1 |
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891 KB |
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