SMART DuraFlash BGAE540 EMMC Is a Soldered-down Flash Storage Solution Provides Stable High-density Embedded Storage
SMART’s DuraFlash BGAE540 eMMC is a soldered-down Flash storage solution that combines NAND Flash memory, an embedded MMC (MultiMediaCard) Controller, and advanced firmware in a small BGA (Ball Grid Array) package that provides stable, yet cost effective high-density embedded storage. The BGAE540 eMMC is designed to meet the rigid requirements of the industrial, medical and networking markets.
SMART’s BGAE540 eMMC is compliant to eMMC v5.1 specifications and is available in the standard JEDEC 0.5mm pitch, 153-ball BGA package, as well 1.0mm pitch, 100-ball BGA package. The 100-ball package offers larger ball pitch and ball diameter enabling lower cost PCB designs and simplifies PCB routing with wider metal traces.
Features & Benefits
• Compliant to JEDEC v5.1 Standard
• BGAE540 SE: Base eMMC, TLC NAND with Capacities from 16GB to 128GB
• BGAE540 UE: Pre-configured to pSLC Enhanced Storage Media Mode with User Capacities from 5GB to 40GB
• Industrial Temp (-40°C to +85°C)
Applications
• Factory Automation
• IIoT
• Medical Devices
• Networking Appliances
• POS Terminals
• RFID Scanners
• Single-Board Computers
• Telecom Infrastructure
Product Family Overview
Specifications (BGAE540 SE)
Specifications (BGAE540 UE)
- 【Datasheet】BGAE540 | eMMC | 153-ball/100-ball
- 【Datasheet】BGAE540| eMMC | 153-ball/100-ball
- 【Datasheet】BGAE540 eMMC 153-ball/100-ball embedded memory Product Brief
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