Specification for Base Materials
■This specification defines product, packaging, shipping and general requirements for base materials, as follows:
▲i.Copper-Clad Laminate
▲ii.Unclad Laminate
▲iii.Prepreg
▲iv.Copper foil
●SCOPE:
■This Procedure applies to base materials purchased by TTM Technologies PCB Operations. Deviations to the requirements of this Procedure shall be detailed in writing by the Supplier and submitted to the applicable Purchasing Team for approval/waiver. Purchasing will communicate acceptance of such deviation in writing via a revised Purchase Order (change order).
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Copper-Clad Laminate 、 Unclad Laminate 、 .Prepreg 、 Copper foil |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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7/21/2020 |
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CORP-SA-002 |
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574 KB |
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