Material Specification
CORP-SA-002
Corporate Document
Specification for Base Materials
PAGE 1 OF 8
TTM Technologies, Inc.
Printed copies valid only if stamped “Controlled Copy” by Quality Systems Department
DATE
REVISION
DESCRIPTION OF CHANGES
7/21/2020
New
Initial Release
TITLE
APPROVAL SIGNATURE
DATE
Director of Supply Chain Management
7/21/2020
Corporate Quality
Aileen Rebic
7/21/2020
1.0 PURPOSE:
This specification defines product, packaging, shipping and general requirements for base materials, as
follows:
i. Copper-Clad Laminate
ii. Unclad Laminate
iii. Prepreg
Material Specification
CORP-SA-002
Corporate Document
Specification for Base Materials
PAGE 2 OF 8
TTM Technologies, Inc.
Printed copies valid only if stamped “Controlled Copy” by Quality Systems Department
iv. Copper foil
2.0 SCOPE:
This Procedure applies to base materials purchased by TTM Technologies PCB Operations. Deviations to
the requirements of this Procedure shall be detailed in writing by the Supplier and submitted to the
applicable Purchasing Team for approval/waiver. Purchasing will communicate acceptance of such
deviation in writing via a revised Purchase Order (change order).
Note: If a TTM site has a tighter requirement detailed in their internal Procedure or Work Instruction, it
shall take priority over this document.
3.0 APPLICABLE SPECIFICATIONS:
3.1 IPC-4101 (current revision): Specification for Base Materials for Rigid and Multilayer Printed
Boards
3.2 IPC-4103 (current revision): Specification for Base Materials for High Speed/High Frequency
Applications
3.3 IPC-4202 (current revision): Flexible Base Dielectrics for Use in Flexible Printed Boards
3.4 IPC-4203 (current revision): Cover and Bonding Material for Flexible Printed Circuits
3.5 IPC-4562A-WAM1 (current revision): Metal Foil for Printed Board Applications
3.6 IPC-4563 (current revision): Resin Coated Copper Foil for Printed Board Guidelines
3.7 IPC-4811 (current revision): Specification for Embedded Passive Device Resistor Materials for
Rigid and Multilayer Printed Boards
3.8 IPC-4821 (current revision): Specification for Embedded Passive Device Capacitor Materials for
Rigid and Multilayer Printed Boards
3.9 IPC-1730 (current revision): Laminator Qualification Profile
4.0 PRODUCT REQUIREMENTS
4.1 All laminates shall be manufactured with Class C surface, RTF foil, stamped, unless specified
otherwise on the Purchase Order. Stamp shall consist of the material type, lot number, core
thickness, copper weight, and TTM Material Number, if so required by the specific TTM site.
4.2 All copper foils supplied to TTM shall fulfill IPC-4562 Grade III for high temperature elongation
High Tensile & Elongation (HTE) copper foil, unless otherwise specified on the Purchase Order.
4.3 All copper foils used in the manufacture of laminate shall be electro-deposited copper with one
side surface treated, unless otherwise specified by TTM.
4.4 Laminate shall be stamped. There shall be at least one space between each set of stamped
characters. Laminate with unequal copper weight shall be stamped on the heavier side. All cores
will be stamped on the grain direction side near a corner (3”- 5”) and/or as defined by the